JPH0220426B2 - - Google Patents
Info
- Publication number
- JPH0220426B2 JPH0220426B2 JP55151381A JP15138180A JPH0220426B2 JP H0220426 B2 JPH0220426 B2 JP H0220426B2 JP 55151381 A JP55151381 A JP 55151381A JP 15138180 A JP15138180 A JP 15138180A JP H0220426 B2 JPH0220426 B2 JP H0220426B2
- Authority
- JP
- Japan
- Prior art keywords
- screen
- xyθ table
- printing
- xyθ
- screen printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0804—Machines for printing sheets
- B41F15/0813—Machines for printing sheets with flat screens
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Methods (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15138180A JPS5775889A (en) | 1980-10-30 | 1980-10-30 | Method and device for screen printing |
DE19813142794 DE3142794C2 (de) | 1980-10-30 | 1981-10-28 | Siebdruckverfahren und -vorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15138180A JPS5775889A (en) | 1980-10-30 | 1980-10-30 | Method and device for screen printing |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5775889A JPS5775889A (en) | 1982-05-12 |
JPH0220426B2 true JPH0220426B2 (en]) | 1990-05-09 |
Family
ID=15517322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15138180A Granted JPS5775889A (en) | 1980-10-30 | 1980-10-30 | Method and device for screen printing |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS5775889A (en]) |
DE (1) | DE3142794C2 (en]) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE897929A (nl) * | 1983-10-06 | 1984-04-06 | Bell Telephone Mfg | Zeefdrukinrichting |
JPS61123543A (ja) * | 1984-11-21 | 1986-06-11 | Hitachi Ltd | スクリ−ン印刷機の版合せ方法 |
JPH0529879Y2 (en]) * | 1985-01-29 | 1993-07-30 | ||
IT1184602B (it) * | 1985-06-10 | 1987-10-28 | Ezio Curti | Procedimento e mezzi per stampare a registro il tracciato di un circuito elettronico rispetto a fori praticati in una piastra di supproto |
US4864361A (en) * | 1986-09-03 | 1989-09-05 | Sanyo Electric Co., Ltd. | Screen printing machine |
US4893556A (en) * | 1987-02-23 | 1990-01-16 | Tdk Corporation | Screen printer with double doctor/squeegee, printing pressure sensor and aligning mechanism |
US4981074A (en) * | 1988-06-01 | 1991-01-01 | Hitachi Techno Engineering Co., Ltd. | Method and apparatus for screen printing |
DE3928527A1 (de) * | 1989-08-29 | 1991-03-14 | Ind Siebdruck Systeme Neckarwe | Flachbett-siebdruckmaschine zum bedrucken einer elektrischen leiterplatte |
KR101591612B1 (ko) * | 2012-05-25 | 2016-02-03 | 마이크로·텍 가부시끼가이샤 | 스크린 인쇄기 |
WO2018122938A1 (ja) * | 2016-12-26 | 2018-07-05 | 株式会社Fuji | スクリーン印刷機 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5519849A (en) * | 1978-07-31 | 1980-02-12 | Toshiba Corp | Printing of wafer for semiconductor |
DE8007545U1 (de) * | 1980-03-19 | 1980-06-12 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Justiereinrichtung an einer siebdruckmaschine |
-
1980
- 1980-10-30 JP JP15138180A patent/JPS5775889A/ja active Granted
-
1981
- 1981-10-28 DE DE19813142794 patent/DE3142794C2/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5775889A (en) | 1982-05-12 |
DE3142794C2 (de) | 1983-11-10 |
DE3142794A1 (de) | 1982-05-19 |
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